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为了增强镀液的分散能力和达到良好的镀层效果,电镀工艺常向镀液中投加大量络合剂,这些络合剂与重金属离子配位结合形成络合重金属[1]。电镀过程中,仅有一小部分金属被有效镀在物件上,其他的均以废水的形式排出[2]。络合重金属具有生物难降解性和高毒性,由于络合重金属具有很高的水溶性,且可在广泛的pH范围内稳定存在,故常规的化学沉淀法难于将其从水中去除[3]。
高级氧化技术广泛用于络合重金属的处理,如芬顿氧化[4]、臭氧氧化[5]和电催化氧化[6],解络后游离的重金属离子一般是通过加碱沉淀予以去除。但在电催化处理中,由于可以通过电还原的方式使重金属离子在阴极表面沉积,因此,电催化技术在络合重金属解络的同时还可以实现重金属离子的回收,使出水中的重金属离子浓度极大地降低,从而减少碱的投加和污泥的产生[7]。目前,电催化技术大多基于电催化氧化原理,利用氧化性活性物种(·OH、Cl·和
${\rm{SO}}_4^{ \cdot - }$ )攻击配体结构,使其逐步降解并失去络合性,将重金属离子游离出来[4-8]。但是,在电镀行业中,电镀的原理是利用金属络合物直接在阴极还原,从而使金属电镀在基底材料上[1]。这意味着通过电还原的方式可以破坏金属络合物的络合结构。然而目前采用电还原法处理金属络合物的相关研究鲜有报道。粒子电极是近些年研究比较多的电极材料,通过填充在阴阳极板间构成电极床而实现污染物质的降解去除[9]。在电场的驱动下,粒子可以形成微小的复极性电极,粒子的一端为阳极端,另一端为阴极端,因此在粒子电极的表面既可以发生氧化反应又可以发生还原反应[10]。由于粒子电极大大地增加了污染物与电极之间的有效接触面积,是传统板状电极面积的几十到几百倍,而且每2个相邻的粒子电极之间距离很小,因此,粒子电极的填充缩短了污染物迁移距离和传质距离,提高了传质速率。因而,仅需较低的电流密度即可获得较高的电流强度,并实现较高的电流利用效率[11]。粒子电极床广泛运用在印染废水[12]、焦化废水[13]和制药废水[14]等的废水处理中。粒子电极通常由催化剂和载体组成。常用于电还原的金属催化剂包括Pd、Pt、Fe、Cu、Co和Ni[15-18]。贵金属催化剂具有高催化活性,然而,他们的稀有性和高昂的价格阻碍了其大规模应用。Ni是一种过渡金属,具有高电流密度和低过电位的特点,并且资源丰富、价格低廉和稳定性高。Ni具有出色的还原性能,法拉第效率接近100%,因此,被广泛用作电还原催化剂[19-20]。粒子电极的载体材料有高岭土[21]、γ-Al2O3[22]、泡沫镍[23]、活性炭[24]和介孔碳[25]等,活性炭由于价格低廉、比表面积巨大和化学性质稳定等优点而被广泛用作粒子电极的载体,但其导电性和电子传递效率较差[26]。石墨烯是一种二维碳材料,可以为离子和电子的传输提供较短的有效长度,从而可以增强传质和电荷传输[27-28],在活性炭载体材料中掺杂石墨烯可以增强粒子电极的传质效率和导电性。因此,本文以Ni为催化剂,活性炭(PAC)和氧化石墨烯(GO)为载体制备了催化粒子电极。由于乙二胺四乙酸(EDTA)是一种非常重要的络合剂,广泛应用于镀铜工艺,故本文选择Cu-EDTA作为目标污染物,考察了粒子电极焙烧温度、焙烧时间和PAC与GO比例对Cu-EDTA解络效能的影响,探讨了最佳制备条件下的粒子电极对Cu-EDTA解络和铜回收率的影响及相关机制。
Ni/GO0.2-PAC0.8粒子电极的制备及其降解Cu-EDTA络合物效能
Preparation of Ni/GO0.2-PAC0.8 particle electrode and its degradation performance of Cu-EDTA complex
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摘要: Cu-EDTA在水中具有很强的稳定性,且难以用常规化学沉淀法去除。以粉末活性炭(PAC)和氧化石墨烯(GO)为载体、Ni为催化剂,采用浸渍焙烧法制备了粒子电极,用于Cu-EDTA的电催化降解。采用XRD和SEM-EDS对电极表面的组成和形态进行了表征;探讨了Cu-EDTA解络和铜回收的效能及机制。结果表明,粒子电极最佳制备条件为:焙烧温度为600 ℃、焙烧时间为4 h、PAC与GO质量比为8: 2。粒子电极上的镍主要以Ni0存在,并含有少量NiO。Cu-EDTA和总络合态铜(TCCu)的解络率分别为99.6%和99.4%,总铜(TCu)的回收率为93.7%,解络和铜回收均符合拟一级动力学规律。自由基淬灭和循环伏安扫描实验结果表明,Cu-EDTA的解络是通过电还原完成的,Cu-EDTA中的Cu2+先还原为Cu+,再还原为Cu0并沉积在粒子电极表面。Abstract: Cu-EDTA has strong stability in water and is hard to remove by conventional chemical precipitation methods. The particle electrode that was applied in the electrocatalytic degradation of Cu-EDTA was prepared by impregnation roasting method, using the powdered activated carbon (PAC) and graphene oxide (GO) as the carrier, and nickel as the catalyst. XRD and SEM-EDS were performed to characterize the composition and morphology of the electrode surface. The efficiency and mechanism of Cu-EDTA decomplexation and copper recovery were investigated. The results showed that the optimal conditions of the preparation of particle electrode were: the calcination temperature of 600 ℃, the calcination time of 4 h, and the mass ratio of PAC to GO of 8: 2. The nickel on the particle electrode existed mainly as Ni0, and a small amount of NiO. The decomplexation efficiencies of Cu-EDTA and total complexing copper (TCCu) were 99.6% and 99.4%, respectively. The recovery efficiency of total copper (TCu) was 93.7%. The decomplexation and copper recovery processes were in accordance with pseudo-first order reaction kinetical model. The results of free radical quenching and cyclic voltammetry scanning experiments showed that the decomplexation of Cu-EDTA was completed by electro-reduction. Cu2+ in Cu-EDTA was first reduced to Cu+, then reduced to Cu0 and deposited on the particle electrodes.
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Key words:
- particle electrode /
- electro-reduction /
- nickel /
- Cu-EDTA /
- decomplexation
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表 1 Ni/GO0.2-PAC0.8使用前后的EDS分析
Table 1. EDS analysis of Ni/GO0.2-PAC0.8 before and after use
元素 使用前 使用后 质量分数/% 原子分数/% 质量分数/% 原子分数/% C 74.05 84.46 67.00 77.59 O 15.21 13.03 17.10 17.06 Ni 10.74 2.51 9.00 1.53 Cu — — 2.33 0.54 S — — 6.57 3.28 表 2 Cu-EDTA、TCCu解络和TCu回收反应动力学拟合参数
Table 2. Kinetics parameters of Cu-EDTA, TCCu decomplexation and TCu recovery
污染物 拟合方程 kobs/(min−1) R2 Cu-EDTA −ln(C/C0)=0.018t−0.792 0.018 0.947 TCCu −ln(C/C0)=0.018t−0.946 0.018 0.916 TCu −ln(C/C0)=0.008t−0.428 0.008 0.940 -
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