废弃印刷线路板碘化法浸金研究
Iodine leaching process for recovery of gold from waste PCB
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摘要: 针对碘化法从废弃印刷线路板中提取金的工艺设计,分别考察了碘的质量分数、n(I2)/n(I-)比值、固液比、双氧水的质量分数、pH值、浸出时间和浸出温度对金浸出率的影响。结合正交设计优化实验方法,提出了从废弃印刷线路板中碘化法浸取金的最佳工艺条件:碘的质量分数为1.1%,n(I2)∶n(I-)=1∶10,双氧水的质量分数为1.5%,浸出时间4 h,固液比为1∶10,浸出温度为常温(25℃),溶液pH值为中性,此时金浸出率可达97.5%。Abstract: The design of technical process for recovery of gold from waste printed circuit board(PCB) by iodine leaching process was investigated. The influences of iodine concentration, the ratio of n(I2) to n(I-), H2O2 concentration, the ratio of solid to liquid, leaching time, pH, leaching temperature were studied. Through orthogonal experiment, the most optimized qualifications of iodine leaching gold from waste PCB are elicited: iodine concentration 1.1%,n(I2)∶n(I-)=1∶10,H2O2 concentration 1.5%, the leaching time 4hr,the ratio of solid to liquid 1∶10, leaching gold at normal temperature(25℃), pH=7.Gold leaching recovery can reach 97.5%.
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Key words:
- waste printed circuit board /
- iodine process /
- gold leaching /
- orthogonal experiment
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